Adjustable shoe mold set
US8540502B2 · kind B2 · utility
1Cited by
7References
11Claims
0Family size
Inventor
Key dates
| Filing date | Jan 12, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D35/0072
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A shoe mold set includes a mold, a movable block and an adjustment unit. The mold is connected to the movable block, and both are slidably between two rail members of the replacement unit. The replacement unit is connected with the adjustment unit which is adjustably located between the top board and the bottom board of the replacement unit. The mold is micro-adjustable by operation of the adjustment unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.