Substrate processing method
US8540824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2010 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Jun 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.