Patent · US Active

Target arrangement for mounting / dismounting and method of manufacturing

US8540850B2 · kind B2 · utility

0Cited by

5References

12Claims

0Family size

Assignee

OC Oerlikon Balzers AG · LI

Inventors

Marcel Neusch · Seuzach, CH
Peter Schlegel · Obernzenn, DE
Hartmut Rohrmann · Schriesheim, DE
Oliver Rattunde · Buchs, CH

Key dates

Filing date	Dec 14, 2006
Grant date	Sep 24, 2013
Priority date	—
Expiry date	Jan 9, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3435
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border (7) defined by a first wedge surface (5u) angled to the addressed general plane (E) and a second wedge surface (5l) which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.