Microelectronic package having direct contact heat spreader and method of manufacturing same
US8541876B2 · kind B2 · utility
7Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Dec 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.