Bonding apparatus and method
US8545660B1 · kind B1 · utility
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Key dates
| Filing date | Mar 20, 2012 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.