Patent · US Active

Critical dimension control during template formation

US8545709B2 · kind B2 · utility

4Cited by
1References
13Claims
0Family size

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Inventors

Key dates

Filing dateApr 6, 2012
Grant dateOct 1, 2013
Priority date
Expiry dateApr 6, 2032

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB82Y40/00
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.