Critical dimension control during template formation
US8545709B2 · kind B2 · utility
4Cited by
1References
13Claims
0Family size
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Key dates
| Filing date | Apr 6, 2012 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Apr 6, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.