Fabric containing non-crimped fibers and methods of manufacture
US8546260B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Sep 3, 2009 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Mar 12, 2030 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD04H1/498
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.