Photocurable dicing die bonding tape
US8546485B2 · kind B2 · utility
0Cited by
15References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 5, 2013 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10329
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.