Kevin Becker
3Patents
1h-index
5Co-inventors
37Inventor score
Filing activity: Oct 29, 1998 → Mar 13, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6066710A | Imide-containing polymers made by bulk polymerization | Chemistry; Metallurgy | 11 | Expired |
| US8546485B2 | Photocurable dicing die bonding tape | Electricity | 0 | Active |
| US8759422B2 | B-stageable and skip-curable wafer back side coating adhesives | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.