Patent · US Active

Multi-die stack package

US8546955B1 · kind B1 · utility

184Cited by
4References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 16, 2012
Grant dateOct 1, 2013
Priority date—
Expiry dateAug 16, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/157
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An embodiment of an apparatus is disclosed. This embodiment of the apparatus includes an interposer, a first die stack, a second die stack, a third die stack, and a fourth die stack which are all coupled to the interposer. The interposer provides a common base for and a stratum of each of the first die stack, the second die stack, the third die stack, and the fourth die stack. The first die stack includes an optical engine. The optical engine includes at least one optical engine die. The second die stack includes a plurality of programmable resource dies. The third die stack includes at least one memory die. The fourth die stack includes a serializer-deserializer die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.