Electronic system with a composite substrate
US8547709B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2010 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Mar 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.