Efficient inter-chip optical coupling
US8548288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2011 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Apr 5, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.