Method of manufacturing liquid discharge head substrate and method of processing the substrate
US8549750B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jun 17, 2009 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Jun 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of processing a liquid discharge head substrate includes the step of providing a recessed portion in the back surface of the substrate by discharging a manufacturing liquid in a linear trajectory to the back surface of the substrate and by irradiating the back surface of the substrate with laser light that passes along and in the manufacturing liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.