Clad solder thermal interface material
US8550327B2 · kind B2 · utility
4Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2011 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12222
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.