Electronic component-embedded printed circuit board
US8552305B2 · kind B2 · utility
3Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Mar 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.