Heat-radiating substrate and method of manufacturing the same
US8553417B2 · kind B2 · utility
3Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Jun 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.