Process of assembling a probe
US8555482B2 · kind B2 · utility
22Cited by
19References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 5, 2010 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Jun 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process of assembling a probe that includes providing a circuit board that is connectable to a sensor and is connected to a first electrical connector and sliding a housing that has a first end and a second end over the circuit board. The process includes sealingly connecting the first end of the housing and the first electrical connector with a water-tight seal and sealing the second end of the housing with a water-tight seal. Also disclosed is a probe made by the disclosed processes and a sonde including a probe made by the disclosed processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.