Methods of attaching a die to a substrate
US8555491B2 · kind B2 · utility
10Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Apr 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24893
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.