Patent · US Active

MEMS sensor with folded torsion springs

US8555719B2 · kind B2 · utility

10Cited by

2References

19Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Andrew C. McNeil · Chandler, US
Gary Li · Mountain View, US

Key dates

Filing date	Jan 24, 2011
Grant date	Oct 15, 2013
Priority date	—
Expiry date	Nov 25, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG01P2015/0831
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.