Method and installation for exposing the surface of an integrated circuit
US8555728B2 · kind B2 · utility
0Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2007 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Nov 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterized in that it includes the combined application of a laser radiation and a plasma onto the coating initially covering the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.