Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops
US8557698B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2008 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B3/001
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for producing a micromechanical and/or nanomechanical device includes partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate. The method also includes chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer. The portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate is also eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.