Micromechanical component and corresponding production method

US8558327B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Kathrin Knese · Reutlingen, DE
• Heribert Weber · Leverkusen, DE
• Simon Armbruster · Wannweil, DE

Key dates

• Filing date: Feb 29, 2008
• Grant date: Oct 15, 2013
• Expiry date: Jul 8, 2030

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2203/0127
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical component having a conductive substrate, a first conductive layer provided above the substrate and that forms, above a cavity provided in the substrate, an elastically deflectable diaphragm region of monocrystalline silicon and an adjacent peripheral region, a circuit trace level provided above the first conductive layer in a manner that is electrically insulated from the first conductive layer, the circuit trace level having above the diaphragm region a first electrode region and having above the peripheral region a first connection region electrically connected to the same, and a second conductive layer that is provided above the circuit trace level, the second conductive layer having above the diaphragm region a second electrode region that is electrically insulated from the first electrode region, and having above the peripheral region a second connection region electrically insulated from the second electrode region and electrically connected to the first connection region. Also provided is a suitable production method.