Simon Armbruster
33Patents
4h-index
50Co-inventors
66Inventor score
Filing activity: Mar 6, 2003 → Oct 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7354786B2 | Sensor element with trenched cavity | Performing Operations; Transporting | 16 | Active |
| US8470631B2 | Method for manufacturing capped MEMS components | Electricity | 9 | Active |
| US7918136B2 | Micromechanical sensor element | Physics | 8 | Active |
| US8558327B2 | Micromechanical component and corresponding production method | Performing Operations; Transporting | 4 | Active |
| US8492855B2 | Micromechanical capacitive pressure transducer and production method | Physics | 4 | Active |
| US7494839B2 | Method for manufacturing a membrane sensor | Performing Operations; Transporting | 4 | Expired |
| US7647832B2 | Micromechanical device and method for producing a micromechanical device | Performing Operations; Transporting | 2 | Active |
| US8217476B2 | Micromechanical component and method for the manufacture thereof | Performing Operations; Transporting | 2 | Active |
| US7843025B2 | Micromechanical semiconductor sensor | Performing Operations; Transporting | 1 | Active |
| US8749013B2 | Sensor and method for its production | Performing Operations; Transporting | 1 | Active |
| US8530261B2 | Method for producing a component, and sensor element | Performing Operations; Transporting | 1 | Active |
| US9663351B2 | Method for producing a wafer equipped with transparent plates | Emerging Cross-Sectional Technologies | 1 | Active |
| US8148234B2 | Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure | Electricity | 0 | Active |
| US8519494B2 | Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate | Performing Operations; Transporting | 0 | Active |
| US10840107B2 | Method for forming a cavity and a component having a cavity | Performing Operations; Transporting | 0 | Active |
| US9764945B2 | Micromechanical component and corresponding test method for a micromechanical component | Performing Operations; Transporting | 0 | Active |
| US9618740B2 | Micromirror and manufacturing method for at least one micromirror which is situatable or situated in a micromirror device | Physics | 0 | Active |
| US7858424B2 | Method for manufacturing a sensor array including a monolithically integrated circuit | Performing Operations; Transporting | 0 | Active |
| US9885866B2 | Mirror system and projection device | Physics | 0 | Active |
| US7755152B2 | Semiconductor component configured as a diaphragm sensor | Performing Operations; Transporting | 0 | Active |
| US10589988B2 | Mechanical component and manufacturing method for a mechanical component | Emerging Cross-Sectional Technologies | 0 | Active |
| US7572661B2 | Method for manufacturing a micromechanical sensor element | Performing Operations; Transporting | 0 | Active |
| US10431474B2 | Method for forming a cavity and a component having a cavity | Performing Operations; Transporting | 0 | Active |
| US9082831B2 | Component having a via | Electricity | 0 | Active |
| US8389327B2 | Method for manufacturing chips | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.