Temperature compensation in memory devices and systems
US8559218B2 · kind B2 · utility
3Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2011 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Nov 3, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C17/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory are included. One or more embodiments can include a memory device including a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.