Modular low stress package technology

US8560104B2 · kind B2 · utility

Assignees

• STMICROELECTRONICS, INC. · US
• RJR Polymers, Inc. · US

Inventors

• Craig J. Rotay · Audubon, US
• John Ni · San Leandro, US
• David Lam · Redwood City, US
• David Lee DeWire · Superior, US
• John W. Roman · Natick, US
• Richard J. Ross · Houston, US

Key dates

• Filing date: Oct 13, 2010
• Grant date: Oct 15, 2013
• Expiry date: Oct 17, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/09701
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing assembly process.