Patent · US Active

Wafer fabrication process

US8562749B2 · kind B2 · utility

2Cited by

1References

12Claims

0Family size

Assignee

RAVE LLC · US

Inventors

Jeffrey E. LeClaire · Boca Raton, US
Kenneth Gilbert Roessler · Boca Raton, US
David Brinkley · Baltimore, US

Key dates

Filing date	May 20, 2012
Grant date	Oct 22, 2013
Priority date	—
Expiry date	May 20, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S134/902
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.