Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles
US8563362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2010 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Apr 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.