Package tolerate design and method
US8564075B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2011 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Aug 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved MEMS transducer apparatus and method. The apparatus has a movable base structure including an outer surface region and an inner surface region. At least one central anchor structure can be spatially disposed within a vicinity of the inner surface region and at least one peripheral anchor structure can be spatially disposed within a vicinity of the outer surface region. Additionally, the apparatus can have at least one peripheral spring structure. The peripheral spring structure(s) can be coupled to the peripheral anchor structure(s) and at least one portion of the outer surface region. The apparatus can also have at least one central spring structure. The central spring structure(s) can be operably coupled to the central anchor structure(s) and at least one portion of the inner surface region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.