Patent · US Active

Semiconductor arrangement

US8564126B2 · kind B2 · utility

0Cited by

3References

18Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Christian Goebl · Koblenzer Straße, DE
Heiko Braml · Ebermannstadt, DE
Ulrich Herrmann · Graz, AT
Tobias Fey · Erlangen, DE

Key dates

Filing date	Feb 11, 2010
Grant date	Oct 22, 2013
Priority date	—
Expiry date	Dec 21, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor arrangement, in particular a power semiconductor arrangement, in which a semiconductor having a top side provided with contacts is connected to an electrical connection device formed from a film assembly wherein an underfill is provided between the connection device and the top side of the semiconductor. The underfill has a matrix formed from a preceramic polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.