Test socket, and test apparatus with test socket to control a temperature of an object to be tested
US8564317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2010 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Feb 17, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.