Patent · US Active

Wafer chuck for EUV lithography

US8564925B2 · kind B2 · utility

1Cited by

5References

28Claims

0Family size

Assignee

Carl Zeiss SMT GmbH · DE

Inventor

Stephan Six · Aalen, DE

Key dates

Filing date	Jun 17, 2011
Grant date	Oct 22, 2013
Priority date	—
Expiry date	Jul 7, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/70708
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A wafer chuck (1b) having a substrate (2) and having, applied to the substrate (2), an electrically conductive coating (8) for fixing a wafer (6) by electrostatic attraction and preferably having a reflective coating (10) applied to the substrate (2). The coating (8; 10) has at least a first layer (3; 11) under compressive stress and at least a second layer (7; 12) under tensile stress for compensating for the compressive stress of the first layer (3; 11) in order to keep deformation of the wafer chuck (1b) by the coating (8, 10) as low as possible.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.