Method and apparatus for multi-die thermal analysis
US8566760B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2012 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | May 21, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the invention provide a method for performing thermal analysis of a multi-die integrated circuit (IC) design layout. The thermal analysis produces a temperature distribution for analyzing internal properties of each die within the multi-die design and for analyzing thermal interactions between two or more dies of the design based on an internal configuration of the two or more dies. Therefore, in some embodiments, the temperature distribution shows a temperature distribution for each die and the individual temperature distributions show varying temperature across each of the dies. Some embodiments reduce the number of iteration required to perform the thermal analysis by constructing a high quality preconditioner based on thermal conducting segments introduced to model thermal effects at the boundaries between two dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.