Eddy Pramono
11Patents
5h-index
6Co-inventors
55Inventor score
Filing activity: May 8, 2003 → Nov 20, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8104006B2 | Method and apparatus for thermal analysis | Physics | 12 | Active |
| US8103996B2 | Method and apparatus for thermal analysis of through-silicon via (TSV) | Physics | 12 | Active |
| US8104007B2 | Method and apparatus for thermal analysis | Physics | 7 | Active |
| US8504958B2 | Method and apparatus for thermal analysis | Physics | 6 | Active |
| US8201113B2 | Method and apparatus for multi-die thermal analysis | Physics | 6 | Active |
| US9582626B1 | Using waveform propagation for accurate delay calculation | Physics | 4 | Active |
| US6925619B2 | IC conductor capacitance estimation method | Physics | 3 | Expired |
| US8543952B2 | Method and apparatus for thermal analysis of through-silicon via (TSV) | Physics | 3 | Active |
| US7024644B2 | IC signal path resistance estimation method | Emerging Cross-Sectional Technologies | 0 | Expired |
| US8566760B2 | Method and apparatus for multi-die thermal analysis | Physics | 0 | Active |
| US8694934B2 | Method and apparatus for multi-die thermal analysis | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.