Patent · US Active

Automation of interconnect and routing customization

US8566771B1 · kind B1 · utility

4Cited by

8References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Andreas H. A. Arp · Nufringen, DE
Florian Braun · San Antonio, US
Guenther Hutzl · Sindelfingen, DE
Michael V. Koch · Ehningen, DE
Matthias Ringe · Lörrach, DE

Key dates

Filing date	Sep 20, 2012
Grant date	Oct 22, 2013
Priority date	—
Expiry date	Sep 20, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG06F30/394
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A computer identifies a metal layer, in a design, which contains routing track segregated by blockages. The sections of segregated routing track are removed and new routing track are added along the periphery of the blockage. It is determined if contact can be created between the component and the new routing track with the addition of a vertical interconnect access (VIA) structure. If contact can be created, then the VIA structures are added to create contact. If no contact can be created then another new routing track is added with (VIA) structures such that contact is created. Further routing track and VIA structures are added to higher metal layers to form a connection between a routing terminus located on a top metal layer and the new routing track and component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.