Patent · US Active

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

US8569082B2 · kind B2 · utility

17Cited by

2References

9Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Steven Kummerl · Carrollton, US
Sreenivasan K. Koduri · Allen, US

Key dates

Filing date	Sep 24, 2011
Grant date	Oct 29, 2013
Priority date	—
Expiry date	Sep 24, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.