Conductive bump structure on substrate and fabrication method thereof
US8569162B2 · kind B2 · utility
3Cited by
1References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 3, 2012 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Oct 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive bump structure is formed on a substrate having a plurality of bonding pads and a first insulating layer thereon. The first insulating layer has a plurality of openings formed therein for exposing the bonding pads and a conductive post is formed on the bonding pads exposed through the openings. Therein, a gap is formed between the conductive post and the wall of the opening such that no contact occurs between the conductive post and the first insulating layer, thereby preventing delamination of the conductive bump structure caused by stresses concentrating on an interface of different materials as in the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.