Integrally molded die and bezel structure for fingerprint sensors and the like
US8569875B2 · kind B2 · utility
8Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2013 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.