Protection layer for preventing UBM layer from chemical attack and oxidation
US8569897B2 · kind B2 · utility
5Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2010 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Nov 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protection layer formed of a CuGeyNz layer, a CuSixNz layer, a CuSixGeyNz layer or combinations thereof is formed on an under-bump metallurgy (UBM) layer for preventing the UBM layer from chemical attack and oxidation during subsequent processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.