Disassembling an item by means of RF energy
US8572831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2010 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Aug 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24521
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Technologies are generally described for providing inductively removable assembly bonding. Inductive elements may be placed strategically at bonding locations between two or more coupled components. At disassembly time, the elements may be heated through Radio Frequency (RF) energy causing the bonds to break and components to separate. For example, inductive elements placed near plastic stake bonds between dissimilar materials in an electronic device may be employed to separate the dissimilar materials during a recycling process. According to some examples, the elements may also be heated through a directly applied electric current via a network of connections designed into the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.