Method for dispensing solder on a substrate and method for mounting semiconductor chips
US8573467B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 2012 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | May 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.