ESEC AG
7Patents
7Active
7Granted
42Portfolio score
Filing activity: Jan 25, 2008 → Sep 13, 2012 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8250742B2 | Die ejector | Emerging Cross-Sectional Technologies | 5 | Active |
| US8166637B2 | Apparatus for mounting a flip chip on a substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US8715457B2 | Method for detaching and removing a semiconductor chip from a foil | Emerging Cross-Sectional Technologies | 2 | Active |
| US8573467B2 | Method for dispensing solder on a substrate and method for mounting semiconductor chips | Electricity | 0 | Active |
| US8106564B2 | Ultrasonic transducer | Electricity | 0 | Active |
| US9603294B2 | Apparatus for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 0 | Active |
| US9082816B2 | Method and apparatus for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.