Electroplating method for coating a substrate surface with a metal
US8574418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2006 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Oct 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.