Patent · US Active

Interconnect system

US8575953B2 · kind B2 · utility

2Cited by

25References

18Claims

0Family size

Assignee

Interconnect Devices, Inc. · US

Inventors

David Henry · Platte City, US
Kiley Beard · Kearney, US
William E. Thurston · Kansas City, US
Jason W. Farris · Parkville, US
Bradley R. Smith · Seattle, US

Key dates

Filing date	Sep 2, 2011
Grant date	Nov 5, 2013
Priority date	—
Expiry date	May 4, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG01R1/07357
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A test contact may include a first portion having an open-ended rounded shape. The first portion may define an opening therethrough. The test contact may include a second portion having a curved structure. The first portion and the second portion may be formed integrally, and the second portion may be configured to contact a portion of a device lead.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.