Robust power plane configuration in printed circuit boards
US8576578B2 · kind B2 · utility
1Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2011 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Dec 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A robust printed circuit board (PCB) that includes at least two power layers that are used in providing power to components connected to the PCB. The power layers may be a power plane layer and a ground plane layer. The power plane layer is situated such that its edge is pulled back a second distance from the planar edge of the PCB. The ground plane layer is situated such that its edge is pulled back a first distance from the planar edge of the PCB. The second distance and the first distance are different, and as a result, the planar edges of the power plane layer and the ground plane layer respectively do not coincide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.