Printed circuit board and method of manufacturing the same
US8581110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2009 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.