Laser processing apparatus, laser processing head and laser processing method
US8581140B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2006 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jan 9, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.