Package structure and semiconductor structure thereof
US8581239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2012 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Apr 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.