Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same
US8581385B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2010 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Nov 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a semiconductor chip body having a top surface, a bottom surface, and side surfaces. The bottom surface may have a groove pattern defined by removing a partial thickness of the semiconductor chip body to extend from one or more edges of the semiconductor chip body toward a center portion of the semiconductor chip body. Through electrodes may be formed to extend from the top surface of the semiconductor chip body and pass through the groove pattern defined on the bottom surface. A heat dissipation pattern may fill in the groove pattern defined on the bottom surface and may be connected with the through electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.