Substrate processing apparatus
US8585030B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 18, 2009 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Dec 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus which can inhibit the occurrence of spots, such as watermarks, by reducing the remaining of the liquid that has been used for liquid treatment, inhibit the turn-over of the wafer, and improve throughput. In the disclosed substrate processing apparatus including a carrying means for carrying a semiconductor wafer W while vertically holding the wafer, a wafer boat (a carrying means) includes lower holders holding the bottom portion of the wafer, and a couple of left/right upper holders for holding the bottom outer edges of the wafer when the wafer is turned over. The lower holder includes a holding groove part and a turn-over prevention groove part, which are integrally formed with each other. The holding groove part includes holding grooves directly holding the bottom portion of the wafer, and the turn-over prevention groove part is disposed adjacent to the holding groove part and includes turn-over prevention grooves for holding the wafer when the holding of the wafer by the holding grooves has been released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.