Silicon controlled rectifier with stress-enhanced adjustable trigger voltage
US8586423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Dec 29, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/36
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Device structures, fabrication methods, operating methods, and design structures for a silicon controlled rectifier. The method includes applying a mechanical stress to a region of a silicon controlled rectifier (SCR) at a level sufficient to modulate a trigger current of the SCR. The device and design structures include a SCR with an anode, a cathode, a first region, and a second region of opposite conductivity type to the first region. The first and second regions of the SCR are disposed in a current-carrying path between the anode and cathode of the SCR. A layer is positioned on a top surface of a semiconductor substrate relative to the first region and configured to cause a mechanical stress in the first region of the SCR at a level sufficient to modulate a trigger current of the SCR.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.